Sprocket Opening Alignment Process and Apparatus for Multilayer Solder Decal

ABSTRACT

A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.

FIELD OF THE INVENTION

The present invention generally relates to the field of injectionmolding of solder (IMS), and more particularly relates to the making ofmultilayer solder decals.

RELATED ART

Gruber et al. in their paper “Low-cost wafer bumping,” IBM Journal ofResearch and Development, IBM JRD 49-4/5(http://www.research.ibm.com/jpournal/rd/494/gruber.html) (Aug. 16,2005) describe flip-chip solder-bump interconnections as the face-downsoldering of integrated circuit (IC) devices to chip carriers by meansof conductive bumps on the chip bond pad. The use of this bumptechnology also extends to passive filters, detector arrays and MEMsdevices. IBM introduced this technology in the early 1960's with thesolid logic technology in the IBM System/360™. It extendedinterconnection capabilities beyond existing wire-bonding techniques,allowing the area array solder-bump configuration to extend over theentire surface of the chip (die) providing solder bumps forinterconnection to a substrate by the C4 (controlled collapse chipconnection) solder reflow process. This allowed for the highest possibleI/O (input/output) counts to meet the increasing demand for electricalfunctionality and reliability in IC technology.

The original wafer-bumping process of metal mask evaporation in whichball-limiting metallurgy (BLM) also known as under bump metallization(UBM) involve the evaporation onto a wafer surface of solder throughmask openings in an area array fashion. The need for increased I/Odensity and count, and pressures to lower the cost of flip-chipinterconnections have spurred the development of other wafer bumpingtechniques such as electroplating or stencil-printing/paste-screening(solder paste) bump processes.

Solder pastes consist of a mixture of solder metal and flux utilized ina reflow process that results in the formation of voids in the solderjoint that in some applications can affect reliability. The end usedictates the selection of the solder paste process since some low-costapplications can tolerate voids. Some of the more newly developedbumping processes include transfer, printing, solder jetting, andbumpless and conductive particle applications.

As IBM's new interconnect technology, C4NP, however, continues to gainvisibility and attention in the industry, new challenges arise in thearea of solder on organic substrates. Here too the pad diameters andpitches (distance between pads) get ever smaller. Presently, the keymethod of applying solder to these pads comprise the use of solder pastescreening, and limits of solder volume vs. pitch are already beingencountered at 150 micron pitches. Inherent volume reductions of between30-50% between the paste as applied and the final solder volume afterreflow make it difficult to apply solder paste in sufficient volumes forever smaller pitches. Consequently, at the tightest pitches, the screenopenings for the solder paste application begin to overlap, thusfundamentally limiting the technology.

No easy solutions exist for these limitations. Other solder applicationtechnologies such as solder jetting and ball drop eliminate the volumereduction problem with solder paste. For jetting, however, thetechnology does not readily lend itself to mass production, but is moresuited for prototyping. For ball drop, the expense of the preformedsolder balls becomes ever higher with smaller sizes, and also presentsdifficulties of grappling with the methods of applying thousands of suchballs quickly, efficiently, and on a large scale. Thus, both of thesealternative solutions are not workable in manufacturing that requiresprecision, relatively high speed, and low cost processes.

Gruber, U.S. Pat. Nos. 5,673,846 and 6,294,745 describes a solder decalapparatus and process to provide a solution to these challenges, andwhile both disclose the advantages of external solder features to assurereliable transfer, as well as dual layer decals to achieve this, they donot disclose a robust method to provide alignment between the decallayers for efficient manufacture on a large scale. The decal layers haveopenings or reservoirs that hold solder subsequently transferred to adiscreet area on an electronic device such as an integrated circuit(IC). Substantial alignment of the upright axes of the reservoirs ineach layer assures maximum transfer of solder in the reservoirs to adiscreet area on the electronic device. Misalignment reduces or preventscomplete or substantially complete transfer of the solder, which in turncan have an adverse affect on the device or in the manufacturing processof the device. The present invention focuses on this substantialalignment as vital to the overall process and provides a process andapparatus compatible with this type of manufacturing that improves onand overcomes some of the difficulties encountered with the related artprocesses and apparatus.

SUMMARY OF THE INVENTION

The foregoing indicates a need for a process and apparatus to obtain adevice comprising soldered electronic components, especially IC devicessoldered to electrically conductive substrates, such as for example byusing IMS processes and substantially minimizing or substantiallyeliminating any of the difficulties encountered in the related artprocesses and apparatus.

Accordingly, the present invention provides such a process and apparatusthat address these needs to not only provide advantages over the relatedart, but also to substantially obviate one or more of the foregoing andother limitations and disadvantages of the related art, such as solderjetting, ball drop, and flux processes and compositions. The inventionalso comprises a product produced by the foregoing process or processes.

The description that follows sets forth features and advantages of theinvention apparent not only from the description but also by practicingthe invention. The written description, drawings, abstract of thedisclosure, and the claims, or as any of the foregoing may besubsequently amended will set forth additional features and advantagesof the invention and particularly point out the objectives and otheradvantages of the invention showing how they may be realized andobtained.

Briefly, IMS, the “parent” technology of C4NP, enables a wide range ofsolder features to be produced in a truly efficient manner formanufacture on a large scale. Gruber, in previously noted U.S. Pat. No.5,673,846, describes one of the unique and novel solder decals that arepossible with IMS. In one form, these decals use two or more layers andafter fill and solidification, they produce solder features that are onthe surface of one of the decal layers. This enables the solder topenetrate openings in the solder resist which is applied over theoutside edges of solder pads on organic substrates. Since the pads areoften up to 20 or more microns below the solder resist layer, thisability to “reach down” to the wetting pad is an enabling feature ofthese solder anchor decals.

However, to be truly manufactured efficiently and on a large scale,these multilayer decals must be alignable before solder injection. Ourinvention details a new method and apparatus to provide quick andrepeatable alignment between several decal layers for efficientmanufacture of electronic devices such as electronic circuits, e.g., ICdevices on a large scale.

To achieve these and other advantages, and in accordance with thepurpose of the invention as embodied and broadly described herein, theinvention comprises aligning reservoir openings in solder decal layersby positioning the reservoir openings in at least two layers (anabutting layer and an abutted layer) to correspond with one another andprovide a plurality of sprocket openings in each layer that correspondwith one another so that alignment of the center axes of the sprocketopenings will effect alignment of the center axes of the reservoiropenings. We use the term “reservoir openings,” as synonymous withreservoir chambers but will use “reservoir openings” to describe ourinvention. We construct the layers so that the sprocket openings insuccessive layer openings have diminishing diameters and then provide asprocket comprising a tapered sprocket so that insertion of that part ofthe sprocket having the narrowest diameter into a sprocket opening inthe layer having the largest sprocket opening diameter up through thesprocket opening in the layer having the narrowest sprocket openingdiameter effects substantial alignment of the center axes of thesprocket openings and consequent substantial alignment of the centeraxes of the reservoir openings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying figures where like reference numerals refer toidentical or functionally similar elements throughout the separateviews, and which together with the detailed description below areincorporated in and form part of the specification, serve to furtherillustrate various embodiments and to explain various principles andadvantages all in accordance with the present invention.

As seen in FIG. 1, a side elevation in cross section, two layers ofsolder decals are aligned and filled with molten solder by IMS toproduce the structure shown. An important requirement is accuratealignment between the top and bottom decal layers. This, inter alia, isthe key focus of this invention.

FIG. 2, a side elevation in cross section, substantially shows thestructure of FIG. 1, but with the top decal layer removed after thesolder has solidified to form a monolithic solder mass. Typical laser orchemical machining of one common decal material, polyimide, produces atapered sidewall as shown. If both layers are oriented in the directionwhere the narrower opening faces up, the top decal layer can be readilypeeled away since the resultant solder shape is non-reentrant in thedirection of the decal peel. What remains is a protruding solder featurein a single layer decal held in place by mechanical anchoring.

FIG. 3, a side elevation in cross section, shows the decal of FIG. 2applied to a substrate requiring the solder application. As seen, themetallic pads on the substrate are below the substrate top surface. Thisrequires the solder to protrude from the decals so that it can “reach”into the metallized pads, as shown.

FIG. 4, a side elevation in cross section, shows the solder of FIG. 3reflowing and wetting the pads. As the protruding portion of the soldermelts and wets the pads, the solder in the reservoir opening of thebottom decal layer (the abutting layer) is pulled out of the reservoiropening through an exit port and provides the balance of the volumerequired to produce the solder bump shown.

FIG. 5, a side elevation in cross section, shows both top and bottomdecal layers (the abutting and abutted layers respectively) empty ofsolder after the transfer to the substrate. These two layers are readyto be realigned and refilled with solder.

FIG. 6, a plan view, shows a detail of decal layer 1, which can be a toplayer, showing the reservoir openings which will receive the solder andthe sprocket openings which have dual functions of moving and aligningthe decal material.

FIG. 7, a plan view, shows decal layer 2, which differs from layer 1 byhaving larger sprocket openings to achieve alignment.

FIG. 8, a side elevation, shows the solder fill method and overallapparatus for achieving an aligned configuration between the two decallayers, comprised of two decal feed reels, an alignment pin loop and asingle filled and joined decal take-up reel.

FIG. 9, a side elevation in cross section, shows a detail of the twodecal layers, the align pin loop layer and the alignment pins engaged inboth decal layers.

FIG. 10, a side elevation, shows transfer apparatus including a feedreel and empty layer take-up reels.

DETAILED DESCRIPTION

We disclose the following detailed embodiments of the present inventionas examples of the invention which can be embodied in various forms.These specific structural and functional details comprise a basis forthe claims and a basis for teaching one skilled in the art to employ thepresent invention in any appropriately detailed process or structure. Wealso employ the terms and phrases of this disclosure to provide anunderstandable description of the invention.

To achieve these and other advantages, and in accordance with thepurpose as embodied and broadly described herein we provide a processand apparatus for aligning a plurality of layers comprising at least twolayers that can be positioned in an abutting relationship with eachother comprising forming a plurality of sprocket openings in each of thelayers for receiving a sprocket of diminishing diameters as the sprocketextends outwardly from a base, with the center axes of the sprocketopenings in each layer being substantially alignable with one another,the largest diameter of the sprocket openings in an abutting layer forfirst receiving the sprocket being greater than the largest diameter ofthe sprocket openings in an abutted layer.

This is followed by forming or providing a plurality of reservoiropenings in each of at least two of the layers comprising at least anabutting layer and at least an abutted layer, the center axes of thereservoir openings being substantially alignable with one another. Weposition the sprocket openings in the layers to correspond with oneanother and the reservoir openings in the layers to correspond with oneanother so that substantial alignment of the center axes of thecorresponding sprocket openings in the layers effects substantialalignment of the center axes of the corresponding reservoir openings inthe layers.

Engaging the sprocket openings with the sprocket by inserting the end ofthe sprocket having the smallest diameter into the sprocket openingshaving the largest diameter in the layers and continuing through to thesprocket opening having the smallest diameter in the layers effectssubstantial alignment of the center axes of the corresponding sprocketopenings and substantial alignment of the center axes of thecorresponding reservoir openings in the layers.

We provide for the diameter of the sprocket and the correspondingdiameter of the sprocket openings to be arranged so that upon theinsertion into the sprocket openings, the sprocket substantially abutssprocket openings in corresponding layers but also allows the layers tosubstantially abut against one another and substantially prevent layerseparation. The sprocket openings comprise a plurality of sprocketopenings arranged in a substantially linear array in each of the layers,and the reservoir openings comprise a plurality of reservoir openings ineach of the layers.

In another aspect, we assemble the plurality of layers so that theabutted layer is the outer-most layer of the plurality of layers. Wedefine the outer-most layer as the abutted layer having the narrowestsprocket openings of the plurality of layers. In order to provide amechanical anchoring mechanism, we arrange the reservoir openings in atleast the abutting layer with diminishing diameters extending toward andopening into the reservoir openings in the abutted layer. In thisembodiment we further provide for a process and apparatus for fillingthe reservoir openings with solder to form a monolithic solder massextending from the reservoir openings in the abutting layer to thereservoir openings in the abutted layer with the reservoir openings inthe abutting layer comprising a mechanical anchoring configuration toenable mechanically removing the abutted layer from the abutting layerwithout substantially removing the solder mass anchored in the reservoiropenings in the abutting layer. In this and other embodiments we fillthe reservoir openings with solder by scanning the reservoir openingsunder an IMS solder head.

In a further embodiment we provide a soldering operation and apparatuscomprising means for advancing the layers to an abutted layer removalarea, such as a rotating sprocket wheel, a ram or moving the layers byhand in the direction of the subsequent processing stations and/orapparatus. We then mechanically remove the abutted layer by prying thelayers apart with apparatus well known in the art, to expose solder fromthe abutted layer as a three dimensional projection of the solder massanchored in but extending outwardly from the abutting layer, and thenbringing the solder projection into contact with a metallized contactpad capable of forming a metallurgical bond with the solder mass,heating the solder mass in a heated transfer area to substantiallytransfer the solder mass to the metallized contact pad and form ametallurgical bond with the metallized contact pad. We advance thelayers to the outer layer removal area and heated transfer area by meansof the sprockets, such as a plurality of sprockets extending from acurvilinear base or linear base and operatively engage the sprocketopenings of the layers. The sprockets may comprise conical orfrusto-conical sprockets extending from the base so that the smallestdiameter of the sprocket projects away from the base

In other embodiments, the layers comprise flexible layers that arewindable on a rotating drum, and the metal pad comprises a metal padoperatively associated with an electronic device such an IC device.

We illustrate aspects of the invention in the drawings in which FIG. 1shows top decal layer 10 and bottom decal layer 20, which are typicallymade from polyimide, but can also be made from a number of otherpolymers that will not substantially degrade when exposed totemperatures employed to melt solder. These comprise inter alia epoxypolymers, phenolic polymers and the like, however, polymers such asthese will generally not have the flexibility necessary for winding thelayers on a drum and will be used in a flat or linear configuration orin combination with a flexible layer. Additionally, the layers maycomprise metal layers, such as metals that solder will not adhere tosuch as stainless steel or other nickel or chromium alloys, aluminum,aluminum alloys, or nickel or chromium or aluminum coated metal ornickel, or chromium or aluminum coated polymers such as those notedherein and the like. Nickel or chromium or aluminum alloys may also beused as the metal coatings. Flexible layers, such as polyimide layers,allow for winding the layers on drums. As noted, layers that do not havesufficient flexibility can be advanced linearly. Shown also arefrusto-conical shaped cavities 80 in top layer 10, and 90 in bottomlayer 20 which are filled with molten solder 30 and 40 respectively thatfuse to form a monolithic solder mass. We also refer to top layer 10 asthe abutted layer and bottom layer 20 as the abutting layer whendescribing the process and apparatus of the invention that employs morethan two layers. We also use this terminology in referring to the otherembodiments of the process and apparatus of the invention.

FIG. 2 has top decal layer 10 removed which leaves solidified solder 30as frusto-conical shaped features on the surface of bottom decal layer20. Solder projections 30 remain when layer 10 is removed since they areconnected to solder cones 40 through the top opening 35 of conicalopening 90. This “anchoring” feature is strictly mechanical, notmetallurgical, since there is no metallurgical attachment of the solderto the bottom polyimide layer 20.

FIG. 3 shows the features of FIG. 2 ready to transfer to a substrate 50through bonding pads 60. Frusto-conical shaped solder features orprojections 30 are aligned to contact the metallized pads 60 onsubstrate 50, even though these are recessed below the surface ofsubstrate 50. This comprises a novel feature of this invention, namelythat these projecting solder features can “reach down” or “reach into”recessed bonding pads before transfer of solder, thus assuring thatsolder wetting will take place once the assembly is heated.

FIG. 4 shows solidified solder 30 and 40 melting and wetting pads 60 tobecome solder bumps 70, which have the combined solder volume of theprevious two frusto-conical shaped features (30 and 40). This step takesplace by heating the joined assembly above the solder meltingtemperature for the time required to form a robust metallurgical bondbetween the molten solder and the pad metallurgy.

FIG. 5 shows both top decal layer 10 and bottom decal layer 20 empty ofsolder, i.e., empty frusto-conical shaped openings 80 and 90. Sincethese are part of continuous films of material, they may be realignedand thereafter refilled with molten solder to begin this processsequence again. Reusability lowers the overall cost of this substratebumping process.

FIGS. 6 and 7 show a plan view of a section of the continuous film ofpolyimide, especially the sprocket openings 100 and 120 and reservoiropenings 110. These two figures are described together, since they areused in this manner. Alignment of the center axes of the reservoiropenings of these two layers, as described herein, allows molten solderto penetrate both layers and thereafter solidify, thus producing thepreviously described positive solder features.

Sprocket openings 100 in FIG. 6 showing the top decal layer 10 areslightly smaller than sprocket openings 120, the bottom decal layer 20of in FIG. 7. This assures optimal alignment accuracy when engaged withtapered alignment pins described in later figures. The critical X-Ydimensions A 130 and A₂ 140 in FIG. 6 and B 150 and B₂ 160 in FIG. 7assure that the much smaller reservoir openings 110 of each layer willaccurately align before the solder filling takes place. When A 130consistently equals B 150 and A₂ 140 consistently equals B₂ 160,alignment is guaranteed. Since these dimensions can bephotolithographically defined, or etched by a well-known process using aprogrammable laser, this accuracy is readily achievable. The sprocketopenings thus serve two functions: the main function of providingcritical alignment between the decal layers, and the secondary functionof moving the joined decal layers along the solder fill andsolidification path. Since polyimide is a mechanically tough material,it can maintain positional accuracy for a workable lifetime of alignmentof the decals.

The reservoir openings 110 in FIG. 7 and corresponding reservoiropenings in FIG. 6, and other layers if more than two layers areemployed, are circular in shape, although any shaped opening can beemployed, such as a polygon having from 3 to about 10 sides, or more, oran ellipse, or other curvilinear configuration. For the purpose of thisinvention, and to define the geometry of these reservoir openings, thesereservoir openings have a diameter, also referred to herein as the “x”axis, ascending or descending along a center axis or “z” axis (definedhereafter), and extending at substantially right angles, e.g., about 90°to the z axis in a flat plane between two opposite points that are atthe widest part of the plane. The reservoir openings also include a “y”axis which lies in the same plane as the diameter, intersects thediameter or x axis substantially at the midpoint, and is atsubstantially right angles, e.g., about 90° to the diameter or x axis.The center axes of these openings, also referred to herein as the “z”axis, extends out of the plane of the diameter, and from a point that issubstantially midway along the length of the diameter and issubstantially at right angles, e.g., about 90° to the plane of the xaxis and substantially right angles, e.g., about 90° to the y axis.

We obtain substantial alignment of the center axes of the reservoiropening according to the process of the invention and by means of theapparatus of the invention. When employing a round, or polygon orellipse or other curvilinear reservoir openings in lieu of a roundopening, we arrange the reservoir openings on the layers so that thereservoir openings' diameters extend in a common plane from the firstlayer to the last layer. For purposes of the invention, substantialalignment of the center axes can also includes this extension of thediameters in a common plane.

An essential feature of the reservoir openings comprises the exit ports42 which allow any liquefied solid material in the reservoir to exit thereservoir after converting any solid material in the reservoir to aliquid material, as in the case of converting solid solder into moltensolder. By making the diameter of the exit port narrower than thediameter of the reservoir, we mechanically anchor the solid material inthe reservoir opening to resist force on the solid in the reservoiropening in a direction away from the exit port. In the embodimentillustrated in the drawings, we provide a frusto-conical reservoiropening with the narrowest diameter of the frusto-conical structureterminating at the exit port. We employ other embodiments, however, toachieve mechanical anchoring. Not only can we employ polygon reservoiropenings with the exit port having a smaller diameter than the diameterof the reservoir opening, we employ such polygon reservoir opening withstepped sides, such as a pyramid that extends from its base to the exitport in a step-wise fashion.

Additionally, we employ reservoir openings with a bulge in the diameterof the reservoir openings, where we configure the bulge as a round disc,curvilinear disc (e.g. an ellipse) or a polygon disc, where the diameterof the bulge is greater than the diameter of the reservoir openings andgreater than the diameter of the exit port. When we employ the bulge, wedo not have to use reservoir openings having tapered side walls. Wedefine the bulge diameter in the same way as the diameter of thereservoir openings. The asymmetry of this configuration provides theanchoring mechanism. We provide this anchoring mechanism in thereservoir opening comprising such an asymmetric configuration, and weposition it somewhere along the z axis of the reservoir opening andbefore the exit port. We also construct this layer, with the bulgeanchoring mechanisms from multiple layers, e.g., a first layer with areservoir opening, a second layer with a bulge or disc configuration anda third layer with an exit port, with the various reservoir openings andexit ports, aligned as described. We then combine these multiple layersto act as a single layer that incorporates the bulge. We also use anycombination of these structures to form this single layer.

We configure the exit ports and the bulge in the same way as thereservoir openings, i.e., they are circular in shape, although any shapecan be employed, such as a polygon having from 3 to about 10 sides, ormore, or an ellipse, or other curvilinear configuration. For the purposeof this invention, and to define the geometry of these configurations,they also have a diameter, referred to herein as the “x” axis, extendingin a flat plane between two opposite points on the x axis plane of theexit ports or the x axis plane of the bulge that are at the widest partof these planes. They also include a “y” axis which lies in the sameplane as the diameter, substantially intersects the midpoint of thediameter or x axis and is at substantially right angles, e.g., about 90°to the diameter or x axis. The center axis, also referred to herein asthe “z” axis, extends away from the plane of the diameter from a pointthat is substantially midway along the length of the diameter or x axisand is substantially at right angles, e.g., about 90° to the plane ofthe x axis, and substantially right angles, e.g., about 90° to the yaxis.

We can also arrange the exit ports and the bulges so that theirdiameters extend in a common plane ascending or descending along the zaxis from the first layer to the last layer. In providing the lockingmechanism referred to before, we can also provide an arrangement of morethan one polygon or ellipse in assembling the layer with the lockingmechanism wherein the polygons or ovals have substantially the samediameter but the diameters of the abutting polygon or ellipse in a firstlayer and the diameter of the polygon or ellipse in an abutted layer areat angles to one another. For example square openings can be provided inthe abutting layer and the abutted area where the diameters are atangles to one another and when viewed in a plan view appear as an eightpointed star. In this instance, the diameters lie in a common plane thatspirals along the z axis where the diameters, ascend and descend the zaxis in a spiral. As in the previous description of the bulgeconfiguration, the foregoing arrangement allows the construction of thereservoir openings so the side walls can be substantially parallel tothe z axis, and do not have to be tapered. For purposes of theinvention, substantial alignment of the center axes can also include theforegoing descriptions of the extension of the diameters in a commonplane.

FIG. 8 shows the apparatus for achieving solder fill in alignedmultilayer decals. Although only two layers are shown, it should beunderstood that three or more layers may be similarly processed. Reel170 contains the polyimide film comprising the top decal layer and reel180 contains the bottom decal layer. These two layers are aligned at thejoin/align stage 190, and thereafter the two joined and aligned layersare preheated at transfer heat zone 192 as they travel towards the IMSfill head 200, where the aligned feature openings are filled with moltensolder. After fill, the joined layers continue to travel along alignmentloop 220 over a cooling zone 202 that solidifies the solder while stillunder the solidification zone 210 of the IMS head. Finally the joinedlayers now containing solidified solder are taken up by reel 230 whichis later used on the solder transfer apparatus.

FIG. 9 is a detailed side view of the engagement of the taperedalignment pins 270 or sprockets attached to the belt 260 of the pin loopbase 220. As the belt 260 containing tapered pins 270 moves in a lineardirection, joined layers 240 and 250 are carried along in an alignedfashion under the slight resistance offered by the IMS fill head 200.The top layer 240 has the smaller sprocket openings and thus tightlyhugs a narrower diameter higher up the tapered alignment pin, whereasbottom layer 250 has the wider sprocket openings, thus hugging thetapered alignment pins at a wider diameter closer to their bottom. Ineach case however, the sprocket openings are tightly fitted to thealignment pins due to their tapered nature. This assures that the keyalignment feature is always present, as any play between the sprocketopenings and alignment pin or sprocket would translate to a possiblemisalignment of the much smaller feature openings. We also arrange thegeometry of the sprocket openings and the corresponding diameter of thesprockets so that upon insertion into the sprocket openings the sprocketnot only substantially abuts the sprocket opening in abutting layers,but also allows these layers to abut against one another andsubstantially prevent layer separation during the alignment process.Stated otherwise we substantially avoid pushing the upper layer awayfrom an abutting layer by sprocket diameters that are too wide for theabutting layer sprocket opening or upper layer sprocket openingdiameters that are too narrow for the sprocket so as to substantiallyavoid pushing the layers apart.

The tapered alignment pins 270 or sprockets comprise frusto-conical pinswith the top of this sprocket configuration being flat or domed. We alsouse sprockets having other tapered configurations, and geometricalconfigurations such as those described hereafter, e.g. tapered polygonshaped sprockets, elliptically shaped tapered sprockets and the like allwith their axes and diameters aligned as described hereafter. In oneembodiment we use a plane solid having saw teeth, with points, as wellas teeth having points removed so as to form flat topped or domed teeth,similar to the frusto-conical sprockets. The side walls of any of thesprockets can be linear or curvilinear, especially, an elliptical wallor an epicycloid wall, the latter configuration being substantially thesame as the gear engaging wall of gear teeth.

We configure the sprockets as tapered three-dimensional devices, havinga diameter lying in a plane circular in shape, although any shape can beemployed, such as a polygon having from 3 to about 10 sides, or more, oran ellipse, or other curvilinear configuration. For the purpose of thisinvention, and to define the geometry of these configurations, thediameter, referred to herein as the “x” axis, lies in a flat planeascending or descending along a “z” axis or center axis (definedhereafter), and further extending at right angles to the z axis, e.g.,about 90° to intersect two opposite points on the plane that are at thewidest part of the plane. They also include a “y” axis which lies in thesame plane as the diameter, substantially intersects the midpoint of thediameter or x axis and is at substantially right angles, e.g., about 90°to the diameter or x axis. The center axis, also referred to herein asthe “z” axis, extends out of the plane of the diameter, and from a pointthat is substantially midway along the length of the diameter and issubstantially at right angles, e.g., about 90° to the plane of the xaxis and substantially right angles, e.g., about 90° to the y axis.

We can also arrange the sprockets so that their diameters extend in acommon plane from the first layer to the last layer. For purposes of theinvention, substantial alignment of the center axes can also includesthis extension of the diameters in a common plane.

The belt 260 comprises a flexible belt known in the art, however, wealso mount the sprockets on a wheel or chain (not illustrated) or a flatsurface (not illustrated). The sprockets 270 and the sprocket openings,in one embodiment are arranged in a substantially linear path on layer 1(FIG. 6) and layer 2 (FIG. 7), aligned in the direction of movement ofthe layers, and are placed especially on the edge of the layers andcomprise one, or two or more arrays of sprocket openings and one, or twoor more corresponding arrays of sprockets.

FIG. 10 shows the final sequence in using multilayer decals. Thissequence is shown from an apparatus view, but the individual stepsexactly match those in FIGS. 1-5. The bumped tape reel 230 has its twojoined decal layers (A) fed into a separator 300 that removes the topdecal layer by forcing it along a modest radius of curvature defined bythe diameter of separator 300. This gentle separation assures that nofrusto-conical solder features previously in top layer frusto-conicalopenings are torn from the frusto-conical solder features in the bottomdecal layer. Since there is no metallurgical bond between solder andpolyimide, the non re-entrant contact in the top decal layer permitsmechanical separation in this manner. The top decal layer (E), now emptyof solder, is taken up by reel 280, leaving the bottom decal layer, nowwith two solder feature layers (B), including the top layer protrudingabove the top surface of the polyimide film, to continue on its way tothe heated transfer area 310. At this point the solder in a specificarray is preheated to prepare for transfer. Substrate 320 is mounted ona XYZ indexing stage that allows it to move to each site on thesubstrate that requires solder. The “XYZ” terminology used to define theindexing stage comprises the x, y, and z axes that the indexing stagemoves on which we define in the same way as the x, y, and z, axes forthe reservoir openings, the sprocket openings and the exit ports. Oncethe specific array has been located on the substrate and aligned to thearray in the bottom decal layer, the indexer moves in a Z direction topush the solder against the substrate pads, the protrudingfrusto-conical features now actually touching with some force themetallized pads recessed below the substrate surface 50 (Cf. FIG. 3).After a pre-set time in which the decal layer lateral motion stops, thesolder becomes molten and thus metallurgically wets the pads, and thisalso pulls the remaining solder out of the frusto-conical opening in thebottom layer (Cf. FIG. 4), the opening volume becoming a solder bump 70attached to the pad 60. After this transfer step, the substrate isseparated from the decal layer by its being moved in a reverse Zdirection away from the decal layer. Thereafter, the bottom decal layerlateral motion resumes and the next solder array is indexed to thetransfer position, while the now newly empty bottom decal layercontinues to reel 290 (E). Although alignment is required betweensubstrate and decal layer, in the transfer sequence there is noalignment required between the two decal layers; instead, as explained,only one decal layer is required for transfer. Thus, both the pins andsprocket openings may or may not be used to move the single bottom layerdecal, as this can also be moved laterally simply by the take up reels280 and 290, or any other device for laterally moving the bottom decallayer, such as a piston, lever, screw assembly and the like, all ofwhich are known to the skilled artisan, the latter being employed wherethe process and/or apparatus employ a layer or layers that do not havethe flexibility to conveniently wind them on a drum.

It should be noted, however, that for transfer, positional orientationof decal layer and substrate is not critical since surface tension andwetting forces far exceed the affects of gravity. Thus for transfer, aslong as the external solder features of the decal layer face thecorresponding pads on the substrate, the decal layer can be the toplayer and the substrate the bottom layer or vice-versa.

Throughout this specification, abstract of the disclosure, and in thedrawings we have set out equivalents, including without limitation,equivalent elements, materials, compounds, compositions, conditions,processes, structures and the like, and even though set outindividually, also include combinations of these equivalents such as thetwo component, three component, or four component combinations, or moreas well as combinations of such equivalent elements, materials,compounds, compositions conditions, processes, structures and the likein any ratios or in any manner.

Additionally, the various numerical ranges describing the invention asset forth throughout the specification also includes any combination ofthe lower ends of the ranges with the higher ends of the ranges, and anysingle numerical value, or any single numerical value that will reducethe scope of the lower limits of the range or the scope of the higherlimits of the range, and also includes ranges falling within any ofthese ranges.

The term “about” or “substantially” as applied to any claim or anyparameters herein, such as a numerical value, including values used todescribe numerical ranges, means slight variations in the parameter. Inanother embodiment, the terms “about,” “substantial,” or“substantially,” when employed to define numerical parameter include,e.g., a variation up to five per-cent, ten per-cent, or 15 per-cent, orsomewhat higher or lower than the upper limit of five per-cent, tenper-cent, or 15 per-cent. The term “up to” that defines numericalparameters means a lower limit comprising zero or a miniscule number,e.g., 0.001. The terms “about,” “substantial” and “substantially” meanthat which is largely or for the most part or entirely specified. Theinventors also employ the terms “substantial,” “substantially,” and“about” in the same way as a person with ordinary skill in the art wouldunderstand them or employ them. The terms “written description,”“specification,” “claims,” “drawings,” and “abstract” as used hereinrefer to the written description, specification, claims, drawings, andabstract of the disclosure as originally filed, and if not specificallystated herein, the written description, specification, claims, drawings,and abstract of the disclosure as subsequently amended.

All scientific journal articles and other articles as well as issued andpending patents that this written description mentions including thereferences cited in such scientific journal articles and other articles,and such patents, are incorporated herein by reference in their entiretyfor the purpose cited in this written description and for all otherdisclosures contained in such scientific journal articles and otherarticles as well as patents and the aforesaid references cited therein,as all or any one may bear on or apply in whole or in part, not only tothis written description, but also the abstract, claims, and appendeddrawings of this application.

Although the inventors have described their invention by reference tosome embodiments, other embodiments defined by the doctrine ofequivalents are intended to be included as falling within the broadscope and spirit of the foregoing written description, drawings,abstract of the disclosure, and claims.

1-32. (canceled)
 33. A process for aligning a plurality of layers comprising at least two layers that can be positioned in an abutting relationship with each other comprising forming a plurality of sprocket openings in each of said layers for receiving a sprocket of diminishing diameters as said sprocket extends outwardly from a base, with the center axes of said sprocket openings in each layer being substantially alignable with one another, the largest diameter of the sprocket openings in an abutting layer for first receiving said sprocket being greater than the largest diameter of the sprocket openings in an abutted layer, forming a plurality of reservoir openings in each of at least two of said layers comprising at least an abutting layer and at least an abutted layer, the center axes of said reservoir openings being substantially alignable with one another. positioning said sprocket openings in said layers to correspond with one another and said reservoir openings in said layers to correspond with one another so that substantial alignment of said center axes of said corresponding sprocket openings in said layers effects substantial alignment of said center axes of said corresponding reservoir openings in said layers, engaging said sprocket openings with said sprocket comprising inserting the end of said sprocket having the smallest diameter into said sprocket openings having the largest diameter in said layers and continuing through to the sprocket opening having the smallest diameter in said layers to effect substantial alignment of said center axes of said corresponding sprocket openings and substantial alignment of said center axes of the corresponding reservoir openings in said layers, providing for the diameter of said sprocket and the corresponding diameter of said sprocket openings to be arranged so that upon said insertion into said sprocket openings, said sprocket substantially abuts sprocket openings in corresponding layers but also allows said layers to substantially abut against one another and substantially prevent layer separation during said alignment.
 34. The process of claim 33 wherein said sprocket openings comprise a plurality of sprocket openings arranged in a substantially linear array in each of said layers, and said reservoir openings comprise a plurality of reservoir openings in each of said layers.
 35. The process of claim 34 further comprising a process for forming a multilayer solder decal wherein said layers comprise solder decal layers.
 36. The process of claim 35 comprising assembling said plurality of layers so that said abutted layer is the outer-most layer of said plurality of layers
 37. The process of claim 36 comprising providing said reservoir openings in at least said abutting layer, said reservoir openings terminating in exit ports adjacent said abutted layer
 38. The process of claim 37 comprising filling said reservoir openings with molten solder to form a monolithic molten solder mass extending from said reservoir openings in said abutting layer to said reservoir openings in said abutted layer, solidifying said molten solder mass to form a solidified molten solder mass, wherein said reservoir openings in said abutting layer comprise a mechanical anchoring configuration to enable mechanical removal of said abutted layer from said abutting layer without substantially removing said solidified solder mass anchored in said reservoir openings in said abutting layer.
 39. The process of claim 38 comprising filling said reservoir openings with solder by scanning said reservoir openings under an IMS solder head.
 40. The process of claim 38 further comprising a soldering operation comprising advancing said layers to an abutted layer removal area, removing said abutted layer to expose said solidified solder mass from said abutted layer as a three dimensional projection of said solidified solder mass anchored in but extending outwardly from said abutting layer, bringing said solder projection into contact with a metallized contact pad capable of forming a metallurgical bond with said solidified solder mass, heating said solidified solder mass in a heated transfer area to substantially melt and transfer said solder mass to said metallized contact pad and form a metallurgical bond with said metallized contact pad.
 41. The process of claim 40 comprising advancing said layers to said outer layer removal area and heated transfer area by means of said sprockets.
 42. The process of claim 41 comprising providing a plurality of sprockets extending from a curvilinear base or linear base and operatively engaging said sprocket openings of said layers.
 43. The process of claim 42 comprising providing conical or frusto-conical sprockets extending from said base so that the smallest diameter of said sprocket projects away from said base
 44. The process of claim 42 comprising providing said layers as flexible layers that are windable on a rotating drum.
 45. The process of claim 44 comprising providing said metal pad as a metal pad operatively associated with an electronic device.
 46. The process of claim 45 wherein said electronic device comprises an IC device.
 47. The process of claim 44 comprising providing said reservoir openings in at least said abutting layer with diminishing diameters extending toward and opening into said reservoir openings in the abutted layer so that the diameter of said exit ports at least in the abutting layer is narrower than any diameter of said reservoir openings. 